SAN FRANCISCO, Aug. 11, 2021 /PRNewswire/ — A new bazaar abstraction appear by All-around Industry Analysts Inc., (GIA) the arch bazaar assay company, today appear its abode titled “Hybrid Anamnesis Cube (HMC) and High-bandwidth Anamnesis (HBM) – All-around Bazaar Trajectory & Analytics”. The abode presents beginning perspectives on opportunities and challenges in a decidedly adapted column COVID-19 marketplace.
FACTS AT A GLANCE Edition: 6; Released: May 2021Executive Pool: 5832Companies: 17 – Players covered accommodate Avant-garde Micro Devices, Inc.; Arira Design; ARM Ltd.; Cadence Design Systems, Inc.; Cray, Inc.; Fujitsu Ltd.; IBM Corporation; Intel Corporation; Marvell Technology Group Ltd.; Micron Technology, Inc.; NVIDIA Corporation; Open-Silicon, Inc.; Rambus, Inc.; Samsung Electronics Co., Ltd.; SK Hynix, Inc.; Xilinx Inc. and Others.Coverage: All above geographies and key segmentsSegments: Application (Graphics, High-performance Computing, Networking, Abstracts Centers); Anamnesis Blazon (HMC, HBM); Artefact blazon (GPU, CPU, APU, FPGA, ASIC)Geographies: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
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ABSTRACT-
Global Hybrid Anamnesis Cube (HMC) and High-Bandwidth Anamnesis (HBM) Bazaar to Ability $3.8 Billion by 2024 A high-performance RAM interface for TSV-based abounding DRAM memory, HMC badly enhances the achievement of accepted anamnesis to a new level, while essentially abbreviation the ability burning and costs. HMC can bear 15 times college achievement as compared to a DDR3 module, while arresting 70% beneath per bit energy. Other key attributes of HMC accommodate aerial per bit anatomy and decreased anatomy agency that acutely enhances absolute anamnesis space. HMC accessory about requires 90% beneath amplitude than the anon attainable RDIMMs. With its awful avant-garde achievement attributes, HMC can action a able belvedere that augments arrangement arrangement achievement to new 100G and college infrastructure, while befitting up with advancements in CPUs and GPUs. The use of HMC DRAM anamnesis is currently actuality advised in applications such as clear cards, abstracts centermost basement and high-performance accretion applications gluttonous bandwidth, anatomy agency and activity efficiencies.
Similarly, Aerial Bandwidth Anamnesis (HBM) is a high-performance RAM interface for 3D-stacked DRAM memory. Fabricated in a advocate angular abounding agreement enabled by TSV technology, HBM extends abundant bigger achievement allowances as compared to accepted DRAM solutions. Key allowances of the HBM technology accommodate awfully bigger anamnesis bandwidth, acutely bargain anamnesis subsystem power, and abate footprint, all of which potentially activate large-scale, industry-wide addition in DRAM anamnesis vertical. HBM makes use of TSV technology and microbumps for abutting abject die and DRAM die to anatomy 1GB DRAM anatomy per device. The archetypal potentially brings new akin of ability in CPUs, GPUs, FPGAs, and ASICs.
Amid the COVID-19 crisis, the all-around bazaar for Hybrid Anamnesis Cube (HMC) and High-bandwidth Anamnesis (HBM) bazaar is projected to ability US$3.8 Billion by 2024, registering a circuitous anniversary advance amount (CAGR) of 28.7% over the assay period. The United States represents the better bounded bazaar for Hybrid Anamnesis Cube (HMC) and High-bandwidth Anamnesis (HBM), accounting for an estimated 49.0% allotment of the all-around total. The bazaar is projected to ability US$2.1 Billion by the abutting of the assay period. China is accepted to spearhead advance and appear as the fastest growing bounded bazaar with a CAGR of 36.2% over the assay period.
The bazaar is growing at a abiding clip apprenticed by assorted advance auspicious factors. Massive acceptance of electronics and agenda technologies in consumer, bartering and automated sectors on the aback of boundless accommodation of ‘Connected World’ fabricated attainable with avant-garde advice protocols and enabling technologies and devices, is creating the assiduous charge for high-bandwidth, scalable and low ability arresting anamnesis solutions.
Sustained amplification in apple abstracts centermost industry, on the aback of abrupt admission in accretion requirements of avant-garde enterprises, is accidental badly to advance and advance of HMC/HBM DRAM anamnesis solutions. To boldness the aerial bandwidth and accommodation requirements, avant-garde abstracts centers are added relying on avant-garde technologies such as IoT, AI and cloud-based services, active the appeal for adult anamnesis solutions in the process. Emergence of High-Performance Accretion (HPC), apropos to the appliance of supercomputers to boldness circuitous computational issues, as reliable apparatus for the common IT industry is favouring boundless advance in HMC and HBM marketplace. Desktop computers usually crave a distinct processing chip, about alleged a CPU, about the processing dent claim for HPC is badly high, area HMC/HBM interfaces can be attainable to boldness the basal complexities. Steered by accelerating developments in AI and ML, HPC acquired absorption in the aftermost few years and the drive in HPC is assertive to abide arctic amidst accretion computational ability requirements of enterprises and accepted consumers, advertence able advance forecasts for HMC/HBM DRAM anamnesis solutions.
Rising acceptance of bogus intelligence (AI), broadly apropos to the intelligence displayed by machines adverse to the accustomed intelligence approved by humans, beyond assorted facets of technology applications is architecture drive anatomy high-tech anamnesis devices. AI acceptance is aerial on an advancing base amidst ascent computational accommodation in the ‘Cloud’, and improvements in adult algorithms, while breeding alongside opportunities to avant-garde accouterments accessories including high-performing anamnesis and processors. Electronic accessory miniaturization is addition above advance disciplinarian for HMC/HBM technology. As MEMS accessories are small, they crave avant-garde anamnesis solutions fabricated in acutely low-footprint designs, but with college anamnesis capacities, for which HMC/HBM can action abeyant alternative. HMC and HBM bazaar additionally stands to accretion from aerial advance drive in abounding DRAM vertical, gauged through added uptake of 3D TSV technology in DRAM fabrication. Arch DRAM anamnesis vendors are prioritizing 3D band stacking with TSV technology to advance high-quality anamnesis accessories to abode the growing high-performance accretion needs of consumers, while creating abounding amplitude for HMC and HBM, the abounding DRAM anamnesis solutions. More
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